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KOMKIA Insights

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Practical notes on PCB fabrication, PCBA assembly, component strategy and manufacturing economics — written by the KOMKIA engineering team.

Latest Articles

From the KOMKIA Engineering Desk

AOI vs SPI on the SMT Line
QualityFeb 12,2026

AOI vs SPI on the SMT Line

One checks the paste, the other checks the part. Use both at the right stage.

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Trace Width and Current Capacity
BasicsFeb 5, 2026

Trace Width and Current Capacity

A trace is a resistor you did not draw. Size it before it heats.

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EMI Shielding in PCB Design
BasicsJan 29, 2026

EMI Shielding in PCB Design

Unwanted radiation is a design choice you made by omission. Close the loops.

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Understanding Gerber Files
BasicsJan 22, 2026

Understanding Gerber Files

The fab speaks Gerber. Know the layers or accept surprises.

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Blind and Buried Vias Explained
BasicsJan 15, 2026

Blind and Buried Vias Explained

Vias that do not go all the way buy routing space at process cost.

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The PCB Plating Process
ProcessJan 8, 2026

The PCB Plating Process

Copper in the holes is what makes a via a via. Plating quality is board quality.

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Moisture Sensitivity Levels (MSL)
BasicsJan 1, 2026

Moisture Sensitivity Levels (MSL)

Moisture inside a package turns reflow into a small explosion. Know your level.

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Low-Temperature Solder Alloys
ProcessDec 25, 2025

Low-Temperature Solder Alloys

When the board or parts cannot take 260 °C, drop the peak with a low-temp alloy.

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Panel Fiducials and Their Importance
ProcessDec 18, 2025

Panel Fiducials and Their Importance

Without fiducials, the machine is guessing. A few marks fix the whole panel.

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