Choosing Substrates for High-Frequency PCBs
FR-4 is fine until it is not. Here is how dielectric constant and loss tangent decide your RF board.
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Practical notes on PCB fabrication, PCBA assembly, component strategy and manufacturing economics — written by the KOMKIA engineering team.
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From the KOMKIA Engineering Desk
IPC Class 2 vs Class 3: What Buyers Should Know
Two acceptance classes, very different cost and reliability expectations. Know which one your product needs.
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Stencil Design and Its Impact on SMT Yield
Aperture ratio, aspect ratio and step-down stencils decide whether your paste print is clean or a mess.
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Lead-Free Solder Paste Storage Best Practices
Solder paste is a perishable. Mishandle the fridge and your first-off yield will tell the story.
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Controlling Warpage During Reflow
Boards that bow in the oven lift small parts off the paste. Here is how to keep them flat.
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X-Ray Inspection for BGA Assembly
You cannot see under a BGA. X-ray is the only way to trust those hidden joints.
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A DFM Checklist Before You Release Gerbers
Most expensive re-spins are avoidable. Run this checklist before you send files to the fab.
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Rigid-Flex PCBs: The Basics
One board that bends where it should and stays rigid where it must. Here is the primer.
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The Role of NPI in an EMS Partnership
New Product Introduction is where prototypes become producible. A good EMS earns its fee here.
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