Low-Temperature Solder Alloys
Bismuth-tin and indium alloys reflow below 200 °C, protecting heat-sensitive assemblies at the cost of lower joint strength.
Alloy options
Sn-Bi and Sn-Bi-Ag lead the low-temp field.
Strength trade
Low-temp joints are more brittle; avoid high-stress locations.
Compatibility
Watch for tin-bismuth interaction with existing SAC joints.
Key Takeaways
Key Takeaways
- Reflow below 200 °C protects parts.
- Low-temp joints are more brittle.
- Mind interaction with SAC.
