X-Ray Inspection for BGA Assembly
Voiding, bridging and head-on-pillow defects live where your eyes cannot reach. X-ray with void measurement turns guesswork into data.
What X-ray reveals
Voids, shorts, open and misaligned balls show clearly in 2D and 3D.
Void limits
Set per-spec void area limits; automotive often demands <15β25% per ball.
When to sample
100% X-ray for critical BGAs; sampling for the rest, risk-based.
Key Takeaways
Key Takeaways
- X-ray is the only view of hidden BGA joints.
- Define void limits per the product spec.
- Use risk-based sampling, full for critical parts.
