Thermal Management in Power PCBs
Copper planes, thermal vias and heatsink interface decide junction temperature. Neglect them and derating eats your margin.
Copper as heatsink
Wide pours and thick copper act as the first heat spreader.
Via strategy
An array of thermal vias ties top copper to inner/back planes.
Interface
TIM choice and clamping pressure set the sink efficiency.
Key Takeaways
Key Takeaways
- Treat copper pours as spreaders.
- Use thermal via arrays to planes.
- Optimize TIM and clamping.
